circuitcardassembly

The SMT process specification is the surface mount technology, which is the standardized requirement inPCB assembly pro[...]

What is a Dual Inline Package? The Dual Inline Package abbreviation is DIP. It is one of the packaging forms of integra[...]

Abstract: With the continuous upgrading of products, traditional printed circuit boards can no longer meet the needs of[...]

Surface mount technology (SMT) and traditional through-hole technology (THT) are the two main component assembly proces[...]

BGA (Ball Grid Array) has become a widely used packaging form in modern electronic devices. BGA rework refers to removin[...]

Printed circuit board assembly is one of the crucial steps in electronic manufacturing. Yet, it's also vital to shorten[...]

With the advancement of science and technology, the types of printed circuit boards have become more and more diverse, a[...]

There are many kinds of electronic materials on PCBA, which cover many key circuit board components. They constitute the[...]